COMPANY PROFILE
CHIEF INT'L, CO., LTD., established in 2019, is a technology company specializing in chip design, manufacturing integration, and advanced technical solutions. Located in Qinchuangyuan, Shaanxi Province, China, CHIEF leverages strong R&D expertise and an integrated industry network to provide efficient and reliable semiconductor solutions to customers worldwide.
Through long-term industry partnerships and collaborative manufacturing resources, CHIEF delivers end-to-end support across semiconductor design, production, packaging, testing, and application development.
With years of technical experience and industry collaboration, CHIEF has built solid expertise in semiconductor integration, packaging technologies, and quality management systems. In 2021, CHIEF obtained ISO 9001 and ISO 14001 certifications, reflecting its commitment to quality assurance, environmental responsibility, and operational standards.
Driven by the principles of technology, integrity, and efficiency, CHIEF continues to enhance its innovation capabilities and expand its global business partnerships through continuous R&D investment and sustainable growth strategies.
CHIEF Founded & Integrated into Qinchuangyuan
ISO 9001 & ISO 14001 Certified
Expanded Packaging & Testing Capabilities
Advanced Customized Chip & Level Shift IC Development
Our ISO 9001 certification reflects a rigorous quality management system that ensures every product and service consistently meets international standards, delivering reliability our clients can count on.
Our ISO 14001 certification demonstrates our commitment to environmentally responsible operations — integrating sustainable practices into every stage of our production and business processes.
CHIEF continues to strengthen its semiconductor innovation capabilities through strategic R&D initiatives focused on customized chip solutions, analog IC technologies, and next-generation mixed-voltage applications.
Developing customized semiconductor solutions tailored to diverse industry applications and evolving market demands.
Tailored semiconductor solutions for diverse application needs.
Advancing proprietary operational amplifier technologies with enhanced stability, reliability, and performance.
Advancing core semiconductor technologies through continuous innovation.
Developing next-generation Level Shift IC solutions with improved compatibility and system integration capabilities for mixed-voltage applications.
Expanding system compatibility and application flexibility.
CHIEF remains committed to strengthening technological innovation, enhancing product competitiveness, and delivering long-term value through continuous semiconductor R&D advancement.
CHIEF leverages an integrated semiconductor supply chain ecosystem and cross-regional collaboration network to deliver reliable manufacturing capabilities, efficient operations, and flexible customer solutions. Through strategic partnerships with leading wafer foundries, packaging & testing facilities, universities, and logistics networks across China, CHIEF continues to strengthen its technological capabilities and operational efficiency.
Strategic partnerships with leading wafer manufacturing facilities ensure stable production capacity and advanced semiconductor manufacturing capabilities.
Collaborating with high-quality packaging & testing partners to support diverse application requirements and reliable product performance.
Integrating technical talent and R&D resources across multiple regions to accelerate innovation and development efficiency.
Strengthening industry-academia collaboration to support talent cultivation and long-term semiconductor innovation.
An integrated logistics network across Shenzhen, Hong Kong, and Xi'an supports operational efficiency and flexible customer support.
Rooted in Qinchuangyuan, CHIEF benefits from a strategically positioned innovation ecosystem with strong industrial collaboration, supply chain integration, and regional development resources. By leveraging a highly integrated network of technology partners, research institutions, and operational support resources, CHIEF continues to strengthen its semiconductor R&D capabilities, commercialization efficiency, and long-term industry competitiveness.
Supporting long-term industrial and technology development.
Access to collaborative innovation and industrial resources.
Supporting sustainable growth and operational expansion.
Accelerating the industrial application of advanced technologies.
Integrated support from R&D to commercialization.
Diversified financial resources supporting long-term growth.
Enhancing operational efficiency and enterprise development.
A seasoned leader with more than two decades of experience in the tech industry.
Former Technical Manager at Beijing Xiaoyu Yilian Company
R&D Director at CHIEF Intl
8 years of professional experience in chip and circuit design
With 15 years of experience in the quality management sector
Former equipment supervisor at ASE
Quality director at Lumens, a Korean company
Quality manager at TSMT, a Taiwanese company
Operations director at CHIEF Intl
CHIEF fosters a culture built on innovation, collaboration, professionalism, and long-term value creation. We believe sustainable growth is driven by technological advancement, operational excellence, and strategic partnerships.
Advancing semiconductor technologies through continuous innovation and forward-thinking development.
Building a highly collaborative and professional team through trust, expertise, and shared goals.
Creating long-term value through strategic partnerships, openness, and mutual growth.
Driven by innovation and operational excellence, CHIEF is guided by three core principles: Technology Leadership, Integrity First, and Cost-Effectiveness Priority.
Driven by continuous R&D investment and cutting-edge semiconductor innovation.
Committed to professionalism, reliability, and long-term customer trust.
Delivering high-quality semiconductor solutions through operational efficiency and supply chain integration.
CHIEF remains committed to advancing semiconductor innovation through continuous R&D investment, strategic supply chain collaboration, and long-term ecosystem partnerships.
Driven by technology, operational excellence, and customer-focused solutions, CHIEF continues to strengthen its competitiveness within global semiconductor markets.
Advancing customized chip development and next-generation semiconductor technologies through continuous innovation and R&D investment.
Strengthening strategic partnerships across manufacturing, packaging, testing, and logistics networks to enhance operational efficiency and customer responsiveness.
Building long-term partnerships with industry leaders, universities, and research institutions to accelerate semiconductor innovation and industrial development.